Design And Analysis Of Multi Vacuum Manifold For Semiconductor Industry Using CAD Tool

Tan , Sze Tian (2011) Design And Analysis Of Multi Vacuum Manifold For Semiconductor Industry Using CAD Tool. Project Report. UTeM, Melaka, Malaysia. (Submitted)

	PDF (24 Pages) Design_And_Analysis_Of_Multi_Vacuum_Manifold_For_Semiconductor_Industry_Using_CAD_Tool_-_24_Pages.pdf - Submitted Version Download (284kB)
	PDF (Full Text) Design_And_Analysis_Of_Multi_Vacuum_Manifold_For_Semiconductor_Industry_Using_CAD_Tool_-_Full_Text.pdf - Submitted Version Restricted to Registered users only Download (2MB)

Abstract

Design and analysis of multi vacuum manifold in semiconductor industry using CAD tool is a title to study efficiency of flow in vacuum gripping system in semiconductor industry. The objective of this study was to investigate the parameter of designing manifold in vacuum system and analyze the results base on simulation software. Air flow was main study on manifold system. From literature review, pressure drop, type of flow involved, and improper design are the factors influence on efficiency of flow in manifold. The study of multi vacuum manifold was carried out parameter involved in to the designs. These designs are including various size of inlet, number of inlet used and the distance between the inlets used. The CAD software selected for undertaken the study were SolidWorks and SolidWorks Flow simulation for creating and simulating the result of the designs. As the result obtain, the design in which total cross section area inlets is less or equal to out resulted better value of velocity and suction pressure distributed in each inlet. The longer distance travels by fluid from inlet to outlet also affect the result obtained. For future study, the design can consider design with manifold system in order obtain better result. Besides, other software such as Ansys can be used for better simulation result. And the design should compare to existing product available in the market, hence the optimization can be implemented.

Actions (login required)

View Item