Characterization of adhesive layer of laminating pressed flexible printed circuit panel

Kok, Hoi Ern (2019) Characterization of adhesive layer of laminating pressed flexible printed circuit panel. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Flexible Printed Circuit (FPC) is a circuit board used for assembling electronic circuit on a flexible substrate. Delamination caused by the uneven temperature and pressure applied in the laminating pressed process of FPC becomes a waste for an industry. The adhesive thickness is proportional to the degree of cure of adhesive that leads to the problem in delamination. This study is to characterize epoxy adhesive thickness and degree of cure as function of laminator opening position. Coverlay with epoxy adhesive is laminated onto copper clad laminate of double-sided flexible printed circuit at 120 kgf/cm, 180°C, and 120 seconds. This study analysis the adhesive thickness using cross-sectional method. It is supported by adhesive squeeze out test and solder float test, and the samples has passed the tests with no delamination occurred. Degree of cure of the adhesive layer is examined using Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). T1 sample with thicker adhesive layer than the T2 sample shows lower degree of cure. Overall, the laminator opening at zone 2, bottom region of the FPC quick press produces FPC panel with thickest adhesive layer. The FPC panel with thicker adhesive thickness has lower degree of cure.

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