Reaction mechanism of electroless quaternary nickel alloy deposition on fe substrate

Ahmad, Muhamad Khaizaki (2015) Reaction mechanism of electroless quaternary nickel alloy deposition on fe substrate. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Electroless deposition of Ni-P alloy is one of the plating methods for coating materials with nickel alloy. It has been widely used in many industries such as mechanical, chemical and electronic industries. This is due to their excellent wear and corrosion resistance and improves solderability properties. Furthermore, the addition of other metallic elements in the Ni-P alloy such as copper, cobalt and tungsten improves the properties of the binary Ni-P deposit such as hardness, smoothness, ductility, corrosion and wear resistance. Recently, the electroless quaternary Ni alloy deposition are developed by addition of two more metallic elements into the binary Ni-P alloy deposit. For example, adding tungsten, W and copper, Cu in the Ni-P that produces quaternary Ni alloy deposited. However, the recent studies are not focusing on the reaction mechanism of quaternary Ni alloy. In this study, the reaction mechanism of quaternary Ni alloy deposition is studied using electrochemical measurement method. The plating baths at various pH and components are used to study the effect of electrochemical measurement. The electrochemical measurements are conducted by using cyclic voltammetry measurement. The higher the plating bath pH the crossing potential, Ec shift to the positive potential which is towards much noble potential. Hence, metal ion is easier to be reduced. In the cyclic voltammetry studied, the higher the pH value, the faster the reduction of the Nickel ions. Besides, the oxidation peak and reduction peak will be lower and broader as pH value increase. This indicates the reaction speed of the plating bath solution. As the peaks become lower the reaction rate will be faster.

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