Analysis on the robotics chip mounter performance

Ab. Kadir, Norkhuzaimah (2014) Analysis on the robotics chip mounter performance. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

In very sophiscated era in line with rapid development, various advanced equipments have been produced by the manufacturer’s pursuit of the sophistication of the time. With this, the products that has been manufactured such as smart phones, medical, communication devices, computers, calculators, automative equipment and others. Production of this product is from the smart appliance which is Printed Circuit Board (PCB). PCB manufactured by industry in the field of Surface Mount Technology (SMT). SMT industry consist of various processes involved in producing products such as substrate bake, solder printing, chip mounting, reflow and flonics 6 tanks. The problem analysis is focusing on the chip mounting process, which have problems during the production process. The main objective of this project to study the efficiency of time and problems that occured on a PCB that was mounted with components. The method used to study this problem is by using Design of Experiment (DOE). This method involves the collection of data on the chip mounter machine. Time taken on a wide variety of components and the machine. It appears the problem often occurs on this machine in the fourth lane in factory when industrial training. The process of mounting the components on the PCB is an important process in the SMT. If the process of mounting the components on the PCB has a different problem, PCB cannot function properly and indirectly will reduce the quality of the semiconductor industry. After obtaining the data, the data were analysed by using Ishikawa diagram (fishbone diagram). The analysis was made by studying man, method, material and machine to see the root problem. Finally, suggestion for reducing this problem occurs is proposed in which it is to add iv a machine vision system to detect components defect before undergoing place the components on the PCB board.

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