Performance Characterization Of Photo Materials Used In Silicon Technology Fabrication Process

Goh, Zia Huey (2013) Performance Characterization Of Photo Materials Used In Silicon Technology Fabrication Process. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This project is carried out to investigate the conventional semiconductor fabrication process and with the focus on measurement of the performance of photo materials as well as to characterize the photo materials for photolithography process. Photolithography is the patterning processes that transfer the designed patterns from the mask to the resist on the wafer. Photo material is a mask which is used to apply on the layer of wafers along with the image from the reticle known as mask to create patterns onto the layer of wafers. The main objective of this project is also to test two different photo materials, namely P7153, which is currently being used by Silterra (M) Sdn. Bhd and P7129, a newly introduced photo material in one of their fabrication process. At the end of the project, the outcome is to suggest the possibility to substitute P7153 with P7129. Measurements and data are taken by using hardware and software such as Hitachi Critical Dimension Measurement Scanning Electron Microscope, wafer scanner, wafer stepper and JMP software at Silterra (M) Sdn. Bhd. Comparison based on proven experimental results can be shown by Bossung curve and process window can be more convincing in suggesting the substitution of old photo material P7153 with the new photo material P7129.

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