Identification Of Intermetallic Compound At Cu Wire – Al Bond Pad Interface By Using X-Ray Diffraction

Nor Rafika, Nor Hamid (2013) Identification Of Intermetallic Compound At Cu Wire – Al Bond Pad Interface By Using X-Ray Diffraction. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This study will be focused on the identification of the crystalline structure at the Copper (Cu) wire - Aluminum (Al) bond pad interface by using X-ray Diffraction (XRD) analysis. There are a few studies about the identification of the Cu-Al IMC have been studied by using other techniques such as Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). Basically, in order to identify the Cu-Al IMC phase, TEM is used to be the selective technique, since it has high resolution that can reveal ultrafine details of material microstructure. Nevertheless, due to the some limitations, XRD technique being the selective technique to replace TEM in order to make the analysis to identify Cu-Al IMC phase at the bonding interface. However, there are some challenges while using this technique. Hence, this study will be focused on the two sample preparation methods which are powder method and etching process. From these two methods, one method would be the selective method by identifying the effectiveness for the both techniques at the end of the experiment.

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