Investigation On Incomplete Fill Problem Of Quad Flat Package In Semiconductor Industry

Mazlan Supawi, Nurul Amiza (2019) Investigation On Incomplete Fill Problem Of Quad Flat Package In Semiconductor Industry. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Nowadays, productivity is the main concern to manufacturing industry. Improving the productivity will improve the quality of the product. There are many alternative that available to improve the productivity. In semiconductor manufacturing industry, incomplete fill is one of the common defects in moulding process that affects product quality. This project is aimed to analyse and determine the root cause of incomplete fill defects faced by a semiconductor manufacturing company in Muar which experienced high number of defects in their production process and to recommend a solution to reduce the defects. In order to improve the process, Six Sigma DMAIC method was used to tackle the problem. This project was conducted according to all five phases of DMAIC which are define, measure, analyse, improve, and control. This method is powerful and proven to reduce defects and improve system since decades ago. In define phase, project goal statement to reduce the reject quantity is constructed and documented. Measure phase is done by collecting the incomplete fill defect for two week and translated into pareto chart. In analyse phase, fishbone diagram and 5 Whys are used to find out the root causes for incomplete fill defects. After root causes are found, suggestions to counter the problem according to the root causes is done in improve phase. Finally, control chart is suggested to be used in control phase.

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