The printability of the conductive polymer epoxy onto the pet flexible substrate

Tan, Yan Hau (2019) The printability of the conductive polymer epoxy onto the pet flexible substrate. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

The applications of the flexible electronic circuit have increase significantly in the recent years. In order to fabricate a good flexible electronic, there are two important components need to be chosen carefully which are conductive polymer epoxy and substrate. Thus, this project will study about the printability of the conductive polymer epoxy onto the PET substrate. In this study, the conductivity of the conductive polymer epoxy will be measured by using four point probe after printed on the PET substrate with different percentage of filler. The sheet resistance value of the sample in ohms-per-square, the resistivity volume in ohms-cm and the sample thickness can be measured using a four-point probe. After that, morphological analysis will be carried out to observe the surface integrity of the conductive epoxy polymer on the PET substrate. By observing the microstructure of the conductive ink can let to know the quality of the of the conductive ink on the substrate. In addition, the gap of the filler particles can also be observed by microscope, this provided the information about the conductivity of sample with different filler loading. After that, correlate the conductivity vs adhesion property of the conductive polymer epoxy after print on the PET substrate is also one part in the study. This study determines the conductivity of the conductive ink will remain the same or change when the substrate is under bending condition. Due to the flexible electronics have to tolerance bending, vibration and stretching so the study of conductivity under these conditions are very important. Through this study, the printability of the conductive polymer epoxy onto the PET substrate can be determined. The conductivity will decrease with increase of filler percentage and the resistivity will maintain under bending test.

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