A Study Of Design For Environment Using Life Cycle Approach For Semiconductor Packaging Processes

Nurul Hidayah , Arshad (2007) A Study Of Design For Environment Using Life Cycle Approach For Semiconductor Packaging Processes. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The greatest opportunity to reduce the environmental impact of a new product occurs during the design phase of its life cycle. Design for Environment (DfE) tools, when implemented, become part of the product development process. DfE tools are one way to assess environmental impact of a product. This paper is focusing on the electronic product of semiconductors which the environmental impact of the processes are evaluated. Tools used in this paper are simple checklist questions and Environmentally Responsible Process-Assessment matrix. This study is conducted in a semiconductor company where the processes involves are evaluated in terms of its contribution to the environment. The environmental concerns that were identified early in the process development can be most effectively and economically resolved and life-cycles studies and DfE can be used as tools to aid in decision-making.

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