Stress And Deformation Analysis On PCB Depaneling

Andrew , Arih (2007) Stress And Deformation Analysis On PCB Depaneling. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This paperwork contains the report of stress and deformation analysis on the application of shearing with support blocks method on Printed Circuit Board (PCB) depaneling. The aims of the study are to analyze the characteristic of the PCB model from manufacturer, determining the stress and deformation on the applied shearing force and identify the maximum shearing force used to cut the depanel tabs on the PCB using Universal Testing Machine (UTM). Depaneling method are selected based on the characteristic of the PCB model's depanel point. The dimensions of PCB model are taken to perform a solid modeling based on the PCB model. From that, the stress and deformation on the PCB model is analyzed using Finite Element Analysis (FEA). Both Solid modeling and analysis are performed using CATIA V5Rl6 software. There are three shearing force has been determined used in the study which are lOON, SOON and lOOON. From the FEA simulation, it has been observed that the value of stress and deformation (displacement) on the depanel tab proportional to the increase of shearing force applied. The use of support blocks has minimized the value of displacement on the shearing area. The experimental testing shows the maximum shearing force used to cut the depanel tabs is 131.7N. The location and the use of support blocks influence the low stress shearing condition on the PCB model.

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