A Study On Current Carrying Capacity Of Double Layer PCB

Mohd Amirul Faruqi, Ismail (2012) A Study On Current Carrying Capacity Of Double Layer PCB. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This project is related with analyzing current carrying capacity (CCC) of a double layer PCB by using statistical approach. In recent years, the design of printed circuit board (PCB) current carrying capacity such as laptop has become increasingly dense with miniaturization of electronic packing. Hence, it is important to design PCB traces for this purpose. The aim of this project is to determine factors that influence current carrying capacity and thermal dissipation and the relation between these variables. This project focuses the double layer of PCB, current injection on traces, traces width, and traces bended corner. The fixed factors are length and room temperature. For the PCB design, PCB Express software was used to ease and save time for the process of designing the width and angle of the desired traces in this study. After the PCB design has been made, that PCB would undergo the process of etching to remove excess traces etching that are not used on the board. Since for the experiment, the current was injected into the PCB traces, after 10 minutes then the temperature of that PCB traces to be stable and the data will be captured using the FLIR Thermal Imager. To ensure that data is accurate, these data taken as 5 times for each PCB traces. Temperature rises on PCB due to a few parameters where some parameters have no significant impact on the temperature rise. It describe about correlations between electrical current and temperature rise of the trace. When there is temperature rise due to distribution and heat dissipation during the flow of current in the PCB traces, this may cause PCB fails to operate normally and causing damage to the PCB operations.

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