The Study Of Magnetic Dial Gauge Precision Ability On Wafer Biscuits Thickness Measurement

Sarah Nadiah, Mohd Ghazali (2010) The Study Of Magnetic Dial Gauge Precision Ability On Wafer Biscuits Thickness Measurement. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

In this project, it is about the research regarding the use and study of magnetic dial gauge use for setting the wafer biscuit thickness. The dial gauge is widely known for measuring, checking and it credibility. It has different type of dial gauge depend on the subject that needs to be measure. The common dial gauge that use is the loose joint arm with standard point. Due to that, the goal of the research is to prove whether this magnetic dial gauge is a precise, accurate and suitable equipment to be use for setting wafer thickness at the baking plate. In this report most of the review is about the magnetic dial gauge and its structure. It include the procedure how is the magnetic dial gauge was use to measure setting the thickness and review regarding the precision and accuracy of this equipment. In this report also include the review of the original baking plate and it process flow. After all the review, it had decided the method where there will be three different factor (indicator tip) to combine with other three different factor (body structure) so that can be compare in order to get accurate and precise result and to achieve the objective of this project. The result compare with the most accurate result in measuring wafer thickness and dial indicator precision between observations of different parameter. The end of this report some suggestion is made to improve the experiment for future study.

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