Subramaniam, Mugilarasan (2023) Validation of stress concentration factor in perforated plates using finite element software. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)
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Validation of stress concentration factor in perforated plates using finite element software.pdf - Submitted Version Restricted to Registered users only until 30 January 2026. Download (0B) |
Abstract
This thesis presents the validation of stress concentration factor in perforated plates using finite element software. The plate that changes its width will have a high stress at the location of the shape changing. The ratio of the highest stress that occurs to the nominal stress that occurs is termed the stress concentration factor. In this project, the finite element software will be tested for its ability to provide results in accordance with engineering charts that are already to provide results in accordance with engineering charts that are already available and are widely used by current reference. The simulation was run in two finite element software this is solidwork and inventor. To prove the accuracy there have some calculation from existing chart like pick nine point from existing chart and find the radius of fillet area to get stress concentration. They have two different modal used to simulate that is I and T plates. I have studied the FEA in two different software. The simulation run for get FEA data and make comparison between finite element software and prove the accuracy of data between existing chart and finite element software.
Item Type: | Final Year Project (Project Report) |
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Uncontrolled Keywords: | Finite element software, Perforated plates, Ratio |
Subjects: | T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) |
Divisions: | Library > Final Year Project > FTKMP |
Depositing User: | Norfaradilla Idayu Ab. Ghafar |
Date Deposited: | 19 Apr 2024 01:58 |
Last Modified: | 02 Dec 2024 07:30 |
URI: | http://digitalcollection.utem.edu.my/id/eprint/31407 |
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