Tan, Ming Yee (2019) Adhesion Integrity Of Epoxy Paste On Thermoplastic Polyurethane(TPU). Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)
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Adhesion Integrity Of Epoxy Paste On Thermoplastic Polyurethane(TPU).pdf - Submitted Version Download (269kB) |
Abstract
This study aspires to have an analysis of carbon filled epoxy conductive ink printed on thermoplastic polyurethane (TPU). The objectives of this study are to evaluate the resistivity of different filler loading of conductive epoxy on TPU substrate, compare the resistivity of epoxy paste under tensile test, and observe the morphological microstructure between epoxy paste and TPU. Specifically, the parameters that were evaluated adhesion integrity which include of sheet resistivity, tensile test and morphological analysis. This project starts with printing of conductive ink on TPU and cured using an oven. In experiment, multimeter is used to measure the sheet resistance value of the sample in ohms-per-square. It can detect the resistivity of different percentage of ink loading. The highest average resistivity is detected in low percentage of ink loading while the lowest one is found in high percentage of ink loading. In tensile test, a self made machine is used to stretch the TPU to test conductivity of conductive ink.The resistivity increase as the conductive TPU stretch, the resisitance decreased. In morphological analysis, light microscope is used to visualize the microscopic image of carbon ink categorized by the electrical properties of the ink. Ink loading with high percentage of carbon particles has conductivity while low percentage has no conductivity. At low percentage, the microstructure image shows no appearance of carbon particles element while for high percentage; the image shows the content of filler loading. The future researchers can use different type of substrate or different materials of conductive ink in order to do the same analysis.
| Item Type: | Final Year Project (Project Report) |
|---|---|
| Uncontrolled Keywords: | Ink, Strength of Materials |
| Subjects: | T Technology > T Technology (General) T Technology > TP Chemical technology |
| Divisions: | Library > Final Year Project > FKM |
| Depositing User: | Norfaradilla Idayu Ab. Ghafar |
| Date Deposited: | 23 Nov 2020 04:34 |
| Last Modified: | 23 Nov 2020 04:34 |
| URI: | http://digitalcollection.utem.edu.my/id/eprint/24791 |
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