The Evaluation On The Effect Of Aging To The Interfacial Bonding Of Pcb Soldered Using SAC305

Muhammad Shukri, Muhammad Zaim Shahmi (2019) The Evaluation On The Effect Of Aging To The Interfacial Bonding Of Pcb Soldered Using SAC305. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Soldering materials show evolving microstructure and mechanical behaviour that exponentially changes with environmental impacts such as isothermal aging and thermal cycling. Mechanical measurements of thermal aging effects and material behaviour development of lead-free solders were performed in the current study. For lead-free solders, 96.5Sn-3.0Ag-0.5Cu (SAC305) was characterized by isothermal aging effects and viscoplastic material developmental evolution. Isothermal aging has been performed at high temperatures (100ºC, 120ºC, 140ºC, 160ºC, 180ºC and 200ºC) in our total experimental program. In this paper, we focused on reporting the results of experiments resulting in temperature aging. Variations in temperature thermal aging dependent mechanical properties (micro hardness, electron microscope scanning, wettability and optical microscope) were observed and modelled as a function about 3-hour. Microstructural changes were also recorded for the solder alloys during the six temperature aging process and correlated with the observed changes in mechanical behaviour

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