Effect Of Humidity On The Mechanical Performance Of Joints Bonded With Electrically Conductive Adhesive

Che Wahab, Nor Fatin Izzati (2018) Effect Of Humidity On The Mechanical Performance Of Joints Bonded With Electrically Conductive Adhesive. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

The research describes about the effect of humidity on the mechanical properties of joints bonded with electrically conductive adhesive.Through the background of the study,the applications of adhesive bonding with electrically conductive adhesive were described together with the advantages and limitations of the adhesive joints.The aim of this research is to investigate the mechanical properties of adhesive joints under various humidity conditions and to examine the surface profiling of adhesive bonding taken under 3D Non-Contact Surface Profilometer.The research covers on the design and fabrication of adhesive joints bonded with electrically conductive adhesive.Apart from that,the methodology used in this research includes the design of jig,preparations of specimens and test joints,and also experimental set up to obtain the analysis of mechanical properties and characterization of surface profiling tested through various humidity conditions.The results shows that the humidity factor will lead to higher shear strength depends on the type of adhesive used together with the effect of surface roughness.In comparison between high and low humidity condition,higher lap shear strength were obtained at low humidity condition as compared to high humidity condition.Besides,from the analysis of surface profiling,it can be analyzed that humidity factor will result in different surface textures depends on the shear strength developed from the mechanical properties of adhesive itself.In this research,the shear strength obtained from the humidity test will depends on the height distributions of the surface profile.For future works,it is recommended to improve the effect of surface roughness by using different techniques instead of mechanical abrasion method in order to enhance the strength of the adhesive joints.Besides,in terms of formulated adhesive as prepared in this project,the future research is recommended to identify the composition ratio of the adhesive with different mix ratio to get variation of results in the mechanical performance of joints bonded with electrically conductive adhesive.

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