Effect Of Different Concentration Of Carbon Nanotube (CNT) In SAC305 Solder Alloy On The Hardness, Wettabilitty And Resistivity Under Thermal Aging

Ali, Khalis Alwi (2018) Effect Of Different Concentration Of Carbon Nanotube (CNT) In SAC305 Solder Alloy On The Hardness, Wettabilitty And Resistivity Under Thermal Aging. Project Report. UTeM, Melaka, Malaysia. (Submitted)

Text (24 Pages) Effect Of Different Concentration Of Carbon Nanotube (CNT) In SAC305 Solder Alloy On The Hardness, Wettabilitty And Resistivity Under Thermal Aging.pdf - Submitted Version Download (415kB)

Abstract

Today, as in this new era, the need of a metal bonding with another metal is high. It is because it is the heart for the electronic industry as it is used a lot in the electronic devices. The metal with the metal bonding can be achieve by the process called soldering. Therefor this project is focusing on finding the best solder paste for the electronic where the solder paste is analysed to find out the most conductive, high resistance in heat and long lasting when there are electric current run into it. For this project, the SAC305 and MWCNT are used as the solder paste that undergoes thermal aging for three hour with four different wt% of CNT (0, 0.01, 0.02, 0.03 and 0.04). The CNT is choose because it have a great electrical properties where it has high conductivity, while SAC305 has a high joint strength and high wettability. Thus the CNT that are mixture with the SAC305 can improve solder properties greatly. The solder paste will undergoes, cold mounting and will be grind to get the cross section part. The cross section part of the solder paste will be analysed using the image analyser, four point probe, nano indenter and ImageJ software. Based on the data, it shows that the solder alloy with 0.04 wt% has the highest result on the electrical conductivity and the wettability where it shows the value of resistivity of 0.2 mΩ/□ and it show the contact angle of 20.979˚. For hardness, the solder alloy with 0.0 wt% has the higher hardness with 17.4 HV and for the IMC thickness, the solder alloy with 0.01 wt% show the closest value to the ideal thickness of IMC layer which is 2.3164 μm.

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