Effect Of Reflow Time On Hardness,Electrical Resistivity And Wettability Of CNT In SAC305

Ghazali, Muhammad Hafizuddin (2018) Effect Of Reflow Time On Hardness,Electrical Resistivity And Wettability Of CNT In SAC305. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

Text (24 Pages) Effect Of Reflow Time On Hardness,Electrical Resistivity And Wettability Of CNT In SAC305.pdf - Submitted Version Download (294kB)

Abstract

This project is about the study of effect of reflow time duration on the properties of solder alloy SAC305 with Carbon Nano-Tube (CNT).SAC305 with CNT solder alloy could help semiconductor industry to spend less manufacturing time,cost and saving environment in the future by using lead free material beside produce better performance products.This paper presents the result of defect, electrical resistivity,hardness and wettability when SAC305 added with 0.04 wt.% of CNT at different reflow durations.The solder paste was reflowed at 243 ºC with different reflow duration of 45, 60 and 75 seconds.The result in structure can be conclude as the reflow duration increased,the structure of the solder alloy had less defects appearances.Next,the resistivity result was improved as the reflow duration reduced from 0.45 to 0.36 mR/sq.Further,the solder alloy hardness becoming higher from 19.72 to 21.64 HV as the reflow duration increased. Lastly,the wettability of the solder alloy improved as the reflow duration was increased as contact angle decreased from 63.5º to 35.3º.As conclusion,these results and studies are expected to help improving solder paste SAC305 with CNT formulation and application.

Actions (login required)

View Item