Reduction of yield loss for taping process in semiconductor industry using TRIZ

Ng, May Ling (2017) Reduction of yield loss for taping process in semiconductor industry using TRIZ. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Yield loss in the semiconductor industry varies based on many factors. The yield loss is distinctly observable and the significant challenge is to quickly identify the root causes. Once the most critical causes are resolved, the productivity and manufacturing quality can be improved as the impact of the yield loss is reduced. Currently, the case company discovered that there is high yield loss for ‘X’ product package on the taper machines after the testing process for the taping process. Therefore, the aim of this study is to reduce the yield loss as to improve the Overall Equipment Effectiveness (OEE) by identifying the root cause of yield loss in a semiconductor industry located at Melaka. The real time data for taping process in the case company was collected. The type of defect that causes yield loss was identified by using Pareto chart. Ishikawa diagram was used to identify the root causes of the significant defects. After identifying the root causes, Theory of Inventive Problem Solving (TRIZ) methodology was applied to propose feasible solutions to the case company for quality yield improvement. There are total three solutions proposed to reduce the yield loss but only two of the solutions were implemented for the case company. The pilot run was carried out to determine the effects and impacts of the proposed solutions implemented in the case company. Based on the results, the yield loss was reduced about 1.14% and OEE was improved about 0.37%. According to the case company’s cost per piece, by increasing 0.37% in OEE enables the case company to gain a total yearly profit of MYR 754,138. Hence, the reduction of yield loss can bring high profitability to the company.

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