Effect of wire EDM process parameters on machining charateristics of aluminium alloy 6061 using Taguchi method

Mohd, Siti Zaharah (2017) Effect of wire EDM process parameters on machining charateristics of aluminium alloy 6061 using Taguchi method. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Electrical Discharge Machining (EDM) is one of non-traditional process (NTP) that can apply on machining complex geometrical design. Wire EDM (WEDM) is one of the types of EDM that used for machining high toughness material, thin material and also can cut micro hole. The main objective of this project is to study the effect of wire EDM process parameter such as pulse ON time, pulse OFF time, peak current, and voltage on machining characteristics such as material removal rate (MRR), kerf width (KW) and surface roughness (Ra) of Aluminum Alloy 6061 (AA6061) using Taguchi method as the design of experiment (DoE) to optimize the machining characteristics. In finding the most significant parameters, analysis of variance (ANOVA) is applied. Type of machine used is WEDM model VZ300L and this project used brass material of wire electrode with diameter of 0.2mm. The MRR is calculated based on weight before machining minus with weight after machining and divided with time machining, and measuring KW by using vertical optical comparator. Then the surface roughness is measured by portable surface roughness. In this project, AA6061 is employed as the specimen in this project because of its difficulties to cut by conventional machine. This material widely used in automotive, construction and aerospace nowadays. Four factors (control parameters) with three levels (low, medium and high) were applied in the Taguchi method to optimize the machining characteristics on WEDM of AA6061. By using Taguchi, there are 9 runs of experiment in this project. The result shows that pulse on time is the most significant factors with highest percentage contribution for each respond either using single or multi objective.

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