Strength analysis of IC package through the impact of dynamic load

Azizan, Noor'ain (2016) Strength analysis of IC package through the impact of dynamic load. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

This report investigates the strength of Integrate Circuit (IC) package through impact of dynamic load. During the production of IC package, there are several effects that affected the IC package component. The dynamic impact of the pogo pin during the assembly can cause the crack or dented in any components of IC package. Therefore, it is importance to investigate the stress distribution on the IC package due to the dynamic impact of the pogo pin. This project constituted the design of model based on a specific package dimensions. The finite element simulation of dynamic study on the model had been performed. The finite element analysis had been analyzed using ANSYS software. The results focus on the stress evaluation of the diepad and die component. The failure analysis by using finite element analysis was performed in several conditions and their impact in dynamic condition had been summarized. To support the result, the developed model and boundary conditions had been justified by comparing the analysis test with the physical test. The result from the validation analysis in a specific condition shows good agreement with the dented area of physical test. The finite element simulation result found that there is the indication of plastic deformation on the diepad and represents as a dented area in physical test.

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