Effect of polycation additive on electrophoretic deposition of surface functionalized boron nitride particles

Abu Bakar, Sabariah (2016) Effect of polycation additive on electrophoretic deposition of surface functionalized boron nitride particles. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Nowadays, electronic devices are constantly shrinking in size while becoming more powerful resulting in increased heat concentration in the device. As a result, thermal management has become crucial to ensure the performance and reliability of high power chips and micro-cooling systems. Actually, when electricity is passed through transistors mounted on an integrated circuit, the transistors, particularly power transistors, generate a substantial amount of heat. Therefore, the heat must be drawn away from the transistors and dissipated to maintain low temperatures and to avoid damaging the transistors. Thus, in this case, electronic packaging is very important to provide mechanical support and manage the heat dissipation of electronics since microelectronics temperatures have significant effect on their reliability since increasing temperature will dramatically decrease electronics life time and performance.

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