Optimizing operator cycle time in a semiconductor company

Chong, Jia Ming (2015) Optimizing operator cycle time in a semiconductor company. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Proper use of resources and good manufacturing strategy are important to stay competitive and to increase profit. Effective use of time for direct labors to perform any type of work will benefit the manufacturer. This study was conducted at a semiconductor company located at Melaka. At present, non-value added (NVA) activities in Front of Line operation have significantly lengthen the operator cycle time. The company wants to reduce the efforts for unnecessary activities and free up some time to focus on value added activities. The aim of this study is to improve operator cycle time by minimizing time wastages caused by NVA activities in production floor. The processes in Front of Line operation are die bonding process, wire bonding process and FAV (Auto Vision) process. Stopwatch time study were conducted to obtain the operator cycle times and it was found that die bonding process contributed to the longest operator cycle time. Value added and NVA activities were identified for the die bonding process based on Lean philosophy and MUDA approach. Appropriate tools such as Pie Chart, Ishikawa diagram and Pareto Chart were used to further analyze the NVA activities. Some suggestions were proposed to the case company in order to eliminate or reduce the time taken on these NVA activities. Stopwatch time study was conducted again to evaluate the effectiveness of the proposed improvement. From the result obtained, operator cycle time in die bonding process has improved by 9.70% after implementation of the proposal. Operators are now having extra time to focus on more productive activities.

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