Planned yield, time yield and simple yield methods to calculate oee metric in semiconductor company

Wong, Carrie Siaw Shien (2015) Planned yield, time yield and simple yield methods to calculate oee metric in semiconductor company. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

In this highly competitive business environment, well run organizations continually strive to enhance their capabilities to create excellent value for the customers by improving the cost effectiveness of the operations. Overall equipment effectiveness (OEE) is employed in organizations to measure the effectiveness of equipment or a production line. This study is conducted at a semiconductor company located at Melaka. The case company plans to improve the quality parameter to stay competitive in the global market. Currently, planned yield figure is employed by case company to calculate the quality parameter. The company needs to validate the accuracy of the current method and to identify better methods, if any, to calculate OEE. The aim of this study is to improve the quality parameter in OEE metric by identifying the causes that contribute to the loss in quality parameter; to validate the planned yield method by using simple yield method and time yield method and propose feasible solutions to the case company for the improvement in quality parameter. This study will only focus on the quality factor in TSLP production line. In order to achieve the objectives, the major factors that contributed to quality loss were identified and several ideas were suggested in order to reduce scrap and rework. The quality parameter had improved by 0.1% based on one week preliminary study regarding the suggested improvement. The three methods to calculate the quality parameter in OEE metric were validated with F-test.

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