Modeling of Stress Developed During Intermetallic Compound Growth at Cu Wire–Al Bond Pad Interface

Nordiyanna, Norazemi (2013) Modeling of Stress Developed During Intermetallic Compound Growth at Cu Wire–Al Bond Pad Interface. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This research is mainly to study the development of stress during the formation of intermetallic (IMC) in Cu wire-Al pad interface. Generally, the excessive growth of IMC in wire bonding systems would degrade the bond reliability. Based on this study, a theoretical model will be developed according to stress developed during intermetallic formation. This model was used to estimate the stress formation based on measurement of the IMC thickness and volume change. The effect of volume changes and thickness will be affected the stress development and yet lead to the formation of voids. In order to perform the simulation, Microsoft Excel was used with several related formulation in order to relate the stress development with volume changes and also the thickness of these IMC.

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