Nordiyanna, Norazemi (2013) Modeling of Stress Developed During Intermetallic Compound Growth at Cu Wire–Al Bond Pad Interface. Project Report. UTeM, Melaka, Malaysia. (Submitted)
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Modeling_of_Stress_Developed_During_Intermetallic_Compound_Growth_at_Cu_Wire_–_Al_Bond_Pad_Interface.pdf - Submitted Version Restricted to Registered users only until 28 June 2018. Download (818kB) |
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Modeling_of_Stress_Developed_During_Intermetallic_Compound_Growth_at_Cu_Wire_–_Al_Bond_Pad_Interface.pdf - Submitted Version Restricted to Registered users only until 28 June 2018. Download (1MB) |
Abstract
This research is mainly to study the development of stress during the formation of intermetallic (IMC) in Cu wire-Al pad interface. Generally, the excessive growth of IMC in wire bonding systems would degrade the bond reliability. Based on this study, a theoretical model will be developed according to stress developed during intermetallic formation. This model was used to estimate the stress formation based on measurement of the IMC thickness and volume change. The effect of volume changes and thickness will be affected the stress development and yet lead to the formation of voids. In order to perform the simulation, Microsoft Excel was used with several related formulation in order to relate the stress development with volume changes and also the thickness of these IMC.
Item Type: | Final Year Project (Project Report) |
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Uncontrolled Keywords: | Solder and soldering, Intermetallic compounds -- Mechanical properties, Intermetallic compounds, Intermetallic compounds -- Diffusion rate |
Subjects: | T Technology > T Technology (General) T Technology > TS Manufactures |
Divisions: | Library > Final Year Project > FKP |
Depositing User: | Jefridzain Jaafar |
Date Deposited: | 24 Jun 2014 06:59 |
Last Modified: | 28 May 2015 04:25 |
URI: | http://digitalcollection.utem.edu.my/id/eprint/12471 |
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