Overall Equipment Effectiveness Optimization (OEE) In Semiconductor Manufacturing Company

Nurul Aini, Ahmad (2013) Overall Equipment Effectiveness Optimization (OEE) In Semiconductor Manufacturing Company. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Overall equipment effectiveness is essential to measure the level of machinery performance. To improve overall equipment effectiveness, first there must be a standard to compare with. The purpose of this research project is to develop the methodology to improve overall equipment effectiveness for the Die Bond and Wire Bond process by using time study method. This study focuses on work measurement methods to obtain real time data from the operation which is then used to compute a standard. Time study is conducted to obtain real time data to first validate the claimed overall equipment effectiveness. In addition, a prerequisite analysis using a Statistical Process Control (SPC) is incorporated to identify critical processes which need improvements. Based on the current state analysis, the maintenance process inside the Die Bond and Wire Bond machine is identified with the highest non-value added activities and thus improvements are proposed and a second time study is performed to measure the enhancement. Improvement on the overall equipment effectiveness is evaluated based on the results of the time study. The proposed improvements bring out an increase in the availability ratio which consequently improved the overall equipment effectiveness by a 1 % for Die Bond and 3% for Wire Bond process.

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