Numerical Analysis-Based : Visualization Technique Of Heat Distribution And Dissipation In Current-Carrying Conductors

Rafiha , Ranom and Alias , Khamis and Zulkifli , Ibrahim and Asri , Din and Mohd Norhisham , Che Soh and Mohd Rizuan , Baharon (2011) Numerical Analysis-Based : Visualization Technique Of Heat Distribution And Dissipation In Current-Carrying Conductors. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

In this research, the heat distribution and dissipation on current carrymg capacity of the PCB was study. There are a lot variable that revealing the impact on the current carrying conductor of PCB such as PCB width and thickness, current supplied, number of traces and trace's location along the PCB length. The prototype PCB was designed as work sample and the experiment was performed. A PCB is supplied with direct current (DC) in range of 0.5A to 5A and then the temperature rise was measured. A mathematical algorithm of heat distribution in one dimensional current carrying conductor of PCB was developed using Finite Element Method (FEM) via Galerkin approach to allocate the temperature. Both result from the simulation and experiment was compared to validate the Galerkin approach. As a result, the mathematical relation between heat distributions and various parameters able for predicting the temperature rise and the requirement of the current carrying conductor of PCB.

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