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Items where Author is "Muhammad Shukri, Muhammad Zaim Shahmi"

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Muhammad Shukri, Muhammad Zaim Shahmi (2019) The evaluation on the effect of aging to the interfacial bonding of PCB soldered using SAC305. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

This list was generated on Thu Apr 24 09:20:16 2025 MYT.
 
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