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Items where Author is "Kok, Hoi Ern"

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Final Year Project

Kok, Hoi Ern (2019) Characterization of adhesive layer of laminating pressed flexible printed circuit panel. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

This list was generated on Thu Jul 10 23:48:18 2025 MYT.
 
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