Browse By Repository:

 
 
 
   

Items where Author is "Kok, Hoi Ern"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Jump to: Final Year Project
Number of items: 1.

Final Year Project

Kok, Hoi Ern (2019) Characterization of adhesive layer of laminating pressed flexible printed circuit panel. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

This list was generated on Wed Oct 2 02:54:44 2024 MYT.
 
UNIVERSITI TEKNIKAL MALAYSIA MELAKA DIGITAL COLLECTION is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.