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Items where Author is "Kok, Hoi Ern"

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Kok, Hoi Ern (2019) Characterization of adhesive layer of laminating pressed flexible printed circuit panel. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

This list was generated on Sat Jul 12 11:46:26 2025 MYT.