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Items where Author is "Kok, Hoi Ern"

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Kok, Hoi Ern (2019) Characterization of adhesive layer of laminating pressed flexible printed circuit panel. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

This list was generated on Fri Apr 4 07:15:21 2025 MYT.
 
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