Integrated Circuit Class/Tape/Packing System For Semiconductor Company (ICCTP)

Ng, Cui Ling (2006) Integrated Circuit Class/Tape/Packing System For Semiconductor Company (ICCTP). Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The Integrated Circuit Class/Tape/Packing (IC CTP) system is a consolidation program written by the researcher using Visual Basic (VB) language. The system is used at the End of Line (EOL) of the semiconductor company. The system is used to print the start class lot, Discreet Classification (DC), Reels, packing and end lot label. At class side, the operator will use the system to get the start class lot label. When the class process completed, the operator will used system to print out the DC label which stated the hold back lot status. At taping side, the lot will start to tape into reels. The operator will scan the taping data into the system to get the Reels label. Then, operator will scan in the packing data into system into the system to get the packing label before pack the lot. After that, the operators will use the system to clear the lot at machine and get the end lot label. Besides, the supervisor can add or modify IC type data here. The engineer can get the engineering report by using the query in the system. The supervisor and engineer must be registered before can access to these options. The database administrator will have the authority to add or delete user data. The waterfall methodology is used as a methodology in developing the project where designs are created, evaluated, and refine with the results of the testing at each cycle feeding into the design focus of the next cycle.

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