A Study On Current Carrying Capacity Of Single Layer PCB

Muhammad A'zim Hakim, Shaharbudin (2012) A Study On Current Carrying Capacity Of Single Layer PCB. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Realizing the increasing importance and demand of a single layer Printed Circuit Board (PCB) in high current carrying capacity is subject of a closer research. This report address on correlations between electrical current and temperature rise on PCB traces. A temperature rise or thermal management is one on of the most important consideration on PCB design that can brings damage to the board if the PCB traces is exposed to a higher temperature than its limits. To prevent this problem, the period of erosion of copper track of the PCB will be estimated from a series of analysis of temperature rise in a single layer PCB. The relation between current and temperature rise in the copper trace of single layer PCB with different width and condition of the trace will be determine. The aim of this research is to determine a relation between current and temperature rise under performance on PCB board. The method to perform this experiment is using current injection from electrical device into PCB trace and the heat will be captured by using a FLIR thermal imager. Finally, data obtained will be analyzed by using statistical approach

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