Identification Of Causes Of Variation In The Semiconductor Manufacturing Processes By Graphical Analysis: A Six Sixma Approach

Mohd Hishamuddin , Mohamad Disa (2009) Identification Of Causes Of Variation In The Semiconductor Manufacturing Processes By Graphical Analysis: A Six Sixma Approach. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Six Sigma is an improvement process, developed by Motorola in 1985. Its use in reducing variation in the production processes could not be denied. Increasing product output without maintaining quality would lead to an increase in the process variation. The objective of this project is to detect and find possible ways to reduce the variation in semiconductor manufacturing production of IC (Integrated Circuit). Sample production data from the industry (an IC manufacturing company) was analyzed graphically to check on the stability of the production process. Possible causes for instability were proposed, based on out-of-control points and threats detected. The process capability was measured to determine if products produced meet customer’s specification. Based on graphical and numerical analyses performed, production process for X1, Y1 and Y2 were out of control, and X2 was stable and capable to meet customer specification, after the elimination of an outlier. All in all, immediate actions should be taken to improve the stability of the production processes so that the output is predictable. This would ensure the best quality of products delivered to customers. Once process has been stabilized, a continuous quality improvement system should be planned and implemented to improvise current process.

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