Identification Of Causes Of Variation In The Semiconductor Manufacturing Processess By Statistical Analysis - A Six Sigma Approach

Tan, Swee Jen (2011) Identification Of Causes Of Variation In The Semiconductor Manufacturing Processess By Statistical Analysis - A Six Sigma Approach. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The purpose of this thesis is to solve the problem of variation in the semiconductor processes by statistical analysis, using the six sigma approach. The current yield loss due to this defect had contributed to the increased production cost due to higher material scrap and rework time. Project objectives were set in Define phase in six sigma approach to detect variation and find possible ways to reduce the variation in the semiconductor manufacturing. The information for the six sigma approach was gathered and the data was collected from a company in the measure phase. A literature review on the six sigma approach will be carried out. The analyze phase results reveal the relationship of vital few causes of variation issue, which led to the defects’ root cause of production of integrated chip (IC). Variation was associated with the environmental and physical factors. Therefore, the relationship between these factors and the functionality and rework ability yield was developed. In Improve phase, the solution was proposed to reduce the variation considering factors such as physical dimension. Process capability (Cp) method is used to observe and analysis the variations of the data. In final Control phase, all the changes and implementation were properly documented, analyzed and planned for the possible solutions. Control chart is drawn using appropriate software such as Minitab to use for analysis of the variation. The result from the project has provided an insight on actual successful deployment of Six Sigma approach with application of its various statistical tools and techniques, and as the systematic problem solving framework on solving actual industrial issues.

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