Process And Yield Improvement For HSDPA Modem Collaboration With Cubic Electronic Sdn Bhd

Norul Husna, Kholiah (2009) Process And Yield Improvement For HSDPA Modem Collaboration With Cubic Electronic Sdn Bhd. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

This thesis will study performance of the product using the HSDPA technology which known as HSDPA Modem. The rapid growth of third generation (3G) telecommunications systems has created the need for getting new test equipment as well as getting measurement techniques up and running in a very short time. In fact, HSDPA (High-Speed Downlink Packet Access) is one example of a packet-based mobile telephony protocol that used in 3G UMTS (Universal Mobile Telecommunication System) radio networks to increase data capacity and speed up transfer rates. Nowadays the growth of the electronic gadgets especially in digital wireless communication is clearly newer on our market. Due to this success, more and more engineers and manufactures are already involved in developing and installing components and systems. Furthermore, to reduce time-to-market, a fundamental issue in a more and more competitive market, they also need to test their designs in a very short time to maintain and optimize the networks carefully. As to ensure the product is significant improved from its transmission quality, the suitable measurement method must be done before the product is launched into the market. Therefore, Cubic Electronics Sdn Bhd must ensure High Speed Downlink Packet Access Modem satisfies the requirement standard before launch in marketing. Trying to satisfy this exigency, a new measurement method for testing High Speed Downlink Packet Access Modem is proposed here for Cubic Electronic Sdn Bhd (CESB). The study will be focused on the development of test procedure for HSPDA Modem using CMU200 Universal Radio Communication Analyzer with directly remoted by CMUgo software application.

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