Electrical conductivity of graphene nanoplatelets reinforced epoxy resin-ENR laminates for electronic packaging

Low, Kai Xin (2021) Electrical conductivity of graphene nanoplatelets reinforced epoxy resin-ENR laminates for electronic packaging. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Electronic packaging is a material used for enclosing, protecting or providing physical structure to either electronic components, assemblies of components or finished electronic devices. The polymeric isotropic conductive adhesive (ICAs) has been widely used to glue the die to a metal lead frame. Yet, the petroleum-based polymeric ICAs are not sustainable but, the service life of natural rubber-based ICAs are relatively short due to low heat dissipation ability. Therefore, this research explores the graphene nanoplatelets reinforced epoxy resin (GNPs/epoxy) -ENRAN laminates for the potential use as ICA. The research focus is to investigate the effect of different graphene nanoplatelets (GNPs) loadings at 0 wt%, 1 wt%, 3 wt%, 5 wt% and 7wt% on the laminate’s electrical properties. The GNPs/epoxy composites were prepared using an ultra-sonication assisted stirring process and applied to glue two sheets of alumina reinforced ENR composite to form laminates. The surface and volume resistivity was measured using an electrical resistivity test (Hiresta-UX MCP-HT800) according to ASTM D257. The electrical conductivity was calculated and compared with three different critical review data. The data was further analysed and supported with postulated findings from critical review on morphological characteristics by the scanning electron microscopy (SEM), compositional analysis via Fourier transform infrared (FTIR) spectroscopy and structural analysis through X-ray diffraction (XRD) analyses to clarify the contributing factors. The different GNPs filler loading has proven to improve the electrical conductivity of the laminates to reach a suitable range for the ICA. The electrical conductivity percolation threshold of the GNPs/epoxy composites is at GNPs loading of 0.2wt% and 1.0wt%, reaching the maximum point at 5wt% and drop at 7wt%. This is due to the worsening of GNPs dispersion in the epoxy matrix due to fillers’ agglomeration effect. The findings were further supported by the critical review on morphological, compositional and structural analyses. This finding would be benefitted to current electronic packaging industries.

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