Tin Electrodeposition On Cu Substrate For Flexible Connector Industries

Sulaiman, Muhammad Afiq (2020) Tin Electrodeposition On Cu Substrate For Flexible Connector Industries. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Copper is commonly used as an electrical conductor because of its high conductivity and less expensive compared to silver and gold. Nonetheless, due to low resistance to corrosion and oxidation to water, copper is required to be coated. Tin coating is therefore used as a corrosion-resistant coating that prevents the copper's oxidation, · thereby maintaining its conductivity. Due to high efficiency and easy mass production, tin electroplating on copper is commonly used method for coating tin on copper. The quality of the tin coating, however, is highly dependent on the parameter of tin electroplating such as current density. The method is already fixed by the supplier for the tin plating procedure. The tin electroplating current density has a significant effect on the microstructure of the tin coating, hardness and deposition rate. It is therefore necessary to investigate it. Tin electroplating was conducted on a Cl 1000 copper substrate using a standard process flow from cleaning and degreasing, rinsing, activation, rinsing before plating, tin electroplating, rinsing after plating and passivation of tin. Using the Faraday's Law Equation, the tin plating time is calculated with 1016, 711 and 545 seconds for the current density of 7, 10 and 13 mA/cm2 . The deposition is done at varying current density. The tin coating microstructure is observed using SEM while XRD analyzes its crystallinity. Using Micro Vickers hardness tester, the surface hardness is measured with 37.33, 68.63 and 86.07 HV for the current density of 7, 10 and 13 mA/cm2 . It shows that a uniform coating is produced by the current density at 13 mA/cm2 between the three of the current density tested. The rise in current density increases the rate of tin electroplating. Addition of additive and other processes increases electroplating surface quality.

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