Design And Analysis Of Bending And Stretchable Testing Apparatus For Conductive Ink

Kamarul' Arifin, Iffah Syakirah (2020) Design And Analysis Of Bending And Stretchable Testing Apparatus For Conductive Ink. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Conductive ink have being widely use in many industry area lately because of the new growing of its technology. The technology have capture many attention from the researchers and company. It have being use widely in most electronic devices such as smart phones and Light Emitting Diodes (LED). The study of this conductive ink is important for further application in the production of various types of electronic devices. Currently, there is no perfect test apparatus for studying conductive ink at the Universiti Teknikal Malaysia Melaka (UTeM). Therefore, the project will focus on the design and analysis of the conductive ink testing apparatus. The reverse engineering and simulation analysis method will be done on the product design, according to the objectives of the project. The method of reverse engineering is to reconstruct the existing product design. In the reverse engineering, it included with the process of finding the customer requirements, engineering characteristics, house of quality (HOQ), preliminary design (PDS), morphological chart, concept design, pugh method and embodiment design. Meanwhile, to find the stress analysis on the product design, two method will be done which are theoretical method and experimental method. It is performed to identify the result of stress produced when a load is imposed on the product. In theoretical method, formula to find out the Von Mises stress will be used while in experimental method, there are two types of Computer-Aided Software (CAD) used in this project. The software is CATIA V5 and Workbench Ansys. The results of the Von Mises stress then will be compared between both of the method to find out the probability of error in the results gained. Based on the study, the percentage error for four parts of the product design is below the expected results, which is 10%. There is one part of the product design is over the expected value. The setting of meshing size may become the effect of the high percentage error on that part.

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