Design Of Pick And Place Mechanism For 3D PCB Assembly Process

Zainan, Muhammad Syazwan (2019) Design Of Pick And Place Mechanism For 3D PCB Assembly Process. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Pick and place systems are one of the handling systems in many of the manufacturing industries. It is either being used in mass production or for sampling task in R&D (Research & Development) work. The system needs to be accurate during the component placement, not time consuming, minimum human intervention and cost effective. In this work, electronics component either SMT (Surface Mount Technology) components or through hole components need to be handled efficiently during placement on 3D PCB (Printed Circuit Board) or sometimes called 3D MID (Molded Interconnected Devices). The focus of this project will be designing a pick and place mechanism for assembling the electronic components on 3D PCBs. The work involves material selection, structural design, constructions and evaluation. As the conclusion, the prototype has been successfully developed. As a result, the new pick and place machine is better than the old practice of manually pick and place electronic components.

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