Effect Of Temperature And Humidity On The Joints Bonded With Electrically Conductive Adhesive

Ismail, Siti Nur Aisyah (2019) Effect Of Temperature And Humidity On The Joints Bonded With Electrically Conductive Adhesive. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Electrically conductive adhesives perform joints that can bond two surfaces by adequate strength and electrical intercom1ection between two bonded surfaces. In this study, the specimen is designed according to the ISO standard of single lap joint. Nowadays adhesively bonded joints are widely used in the product that might be exposed to different enviromnental conditions. Moisture and thermal surroundings are one of the factors that may corrupt the adhesive joints and can cause the failure of the adhesive interconnections. Thus, the objectives of this research are to measure the strength of joints bonded with ECA under the effect of temperature and humidity. This research is iuiplemented by four conditions which temperature at 85°C and 6°C, and humidity at 40°C/85RH and 40°C/45RH. For each of these conditions, the time interval was set at 15 hours, 30 hours, 45 hours, 60 hours and 85 hours. The results of this research are a comparison of tensile strength for each condition. Test results show the higher the temperature gets lower lap shear strength and the same goes for the effect of humidity which low humidity have higher tensile strength compared to high humidity condition.

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