Abdul Aziz, Aida Nazifa (2018) Investigation Of Coverlay Adhesion By Acrylic-Based Adhesive On Copper-Polyimide Laminate For Flexible Printed Circuit. Project Report. UTeM, Melaka, Malaysia. (Submitted)
![[img]](http://digitalcollection.utem.edu.my/style/images/fileicons/text.png) |
Text (24 Pages)
Investigation Of Coverlay Adhesion By Acrylic-Based Adhesive On Copper-Polyimide Laminate For Flexible Printed Circuit.pdf - Submitted Version Download (535kB) |
Abstract
This study is to investigate the coverlay adhesion by using acrylic-based adhesive on copper-polyimide laminate for Flexible Printed Circuit (FPC). Nowadays, the functionality of electronic devices continues to increase at higher rate. FPC is one of the higher requests in various industries. In FPC, lamination process is required to join the coverlay with copper clad laminate (CCL) using acrylic-based adhesive under heat, pressure and interval time. This process is to improve the bonding strength between the materials after curing. One issue that may occur after curing process is delamination of FPC. Thus, the overall thickness of FPC and the correlation of pressure and temperature distribution of lamination press machine towards delamination issue on coverlay adhesion by acrylic-based adhesive on copper polyimide laminate is investigate in this study. Testing and analysis included cross-section test and thermogravimetric analysis (TGA) to characterize the adhesive bonding correlated with acrylic-based adhesive with copper polyimide after curing process in FPC. From the analysis of the layer thickness, the highest and lowest thickness of adhesive is determined using 3D Laser Microscope where the highest thickness is on middle book while the lowest thickness is on top book of FPC. There are no delaminations occurred but the result of the adhesive thickness obtained showing the tendency of delamination to occur. The TGA curve analyzes the weight loss of each material in the FPC where the FPC starts to degrade at temperature 400oC. From the analysis of TGA, the more weight loss in the thermal analysis shows the less bonding strength of adhesive.
| Item Type: | Final Year Project (Project Report) |
|---|---|
| Uncontrolled Keywords: | Printed circuits, Electronic circuit design - Computer-aided design |
| Subjects: | T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Library > Final Year Project > FTKMP |
| Depositing User: | Mohd Hannif Jamaludin |
| Date Deposited: | 16 Dec 2019 03:46 |
| Last Modified: | 16 Dec 2019 03:46 |
| URI: | http://digitalcollection.utem.edu.my/id/eprint/23967 |
Actions (login required)
 |
View Item |
Altmetric
Altmetric