Investigation Of Coverlay Adhesion By Epoxy-Based Adhesive On Copper-Polyimide Laminate For Flexible Printed Circuit

Abdul Latiff, Nurizzatul Zahirah (2018) Investigation Of Coverlay Adhesion By Epoxy-Based Adhesive On Copper-Polyimide Laminate For Flexible Printed Circuit. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

Text (24 Pages) Investigation Of Coverlay Adhesion By Epoxy-Based Adhesive On Copper-Polyimide Laminate For Flexible Printed Circuit.pdf - Submitted Version Download (470kB)

Abstract

This research is an investigation to study the condition of cureness and evenness of pressure distribution in double - sided flexible circuit.This study will examine and analyses 45 samples of five different region in 3 selected layers top,middle and bottom of double sided Flexible Printed Circuit (FPC) with standard epoxy – based adhesive thickness of 25 micron meter and polyimide of 25 micron meter thick.This FPC consists of polyimide, copper clad laminate and epoxy – based adhesive as the main material that undergoes lamination process.This project purpose to identify the overall level thickness of coverlay adhesion by epoxy- based adhesive toward lamination layer distribution and to study on degree of degradation of adhesive in Flexible Printed Circuit (FPC) by using Thermogravitmetric Analysis (TGA).The investigation are focusing on potential of delamination that occurs on the FPC after the lamination.Two methods of testing that are used in this study to examine the cureness and distribution of pressure which are the cross- sectional observation method and TGA Analysis. Both methods are complying to gain the results data in graph and image formed.From results,there were found that there are no delamination occurred.But,there are more potential for the FPC to experience delamination.

Actions (login required)

View Item