Comparison study on the effect of double pogo pin and single pogo pin in the IC package production

A Azizi, Nurul Shafika (2016) Comparison study on the effect of double pogo pin and single pogo pin in the IC package production. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

In the IC package production, there are some problems that might be occurred when a type of pogo pin is used. One of the problem is to identify the failure possibility due to internal stress produced in the IC package during the contact of the pogo pin in the production line. The contact might triggered the failure condition on IC package and the respond is different for both applications of single and double pogo pin. The problems was solved by using Finite Element Analysis by evaluating the effect of the single pogo pin and double pogo pin towards the defects on the contact point of IC package. There are three types of boundary conditions that have been considered in this study. The first condition has the support (the ring shape) on top of the IC package. Then, the support for the second condition at two shorter edges of the top IC package while for third condition, the support is on the entire top IC package. The results of the analysis for the both application have been compared. The use of the double pogo pin has been found to be better choice in order to avoid failure effect when compared with the single pogo pin. The stress distribution for double pogo pin is not reaching the plastic deformation. In contrast, for the single pogo pin, the maximum distribution stress is beyond the yield stress. The model and boundary condition for the single pogo pin have been validated and confirmed by the physical test on a certain scope of condition.

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