Effect Of Electrical Grounding Of Substrate On The Magnetron Sputtering Of Titanium Film

Mohd Nabil Fikri, Hanif (2013) Effect Of Electrical Grounding Of Substrate On The Magnetron Sputtering Of Titanium Film. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

Property of thin film depends on the voltage bias that applied to the depositing substrate during the D.C. magnetron sputtering process. . This shows ionized atoms or molecules are involved in deposition of film to the substrate. The supposed accumulation of charges (ions) on the surface of substrate may affect the deposition of the incoming ionized atom or molecules because like-changes exert repulsive electric force. Improvement of electrical grounding of substrate used for the deposition of Ti film may help to reduce the charge accumulation on the surface of substrate. The reduction of the accumulated charges on the substrate may decrease the repulsion effect on incoming ionized sputtered atoms and increases the deposition rate of sputtered atoms on the substrate. The effect on the Ti film may be exhibited through the microstructure and phase composition of the film. Electrical grounding condition of depositing substrate during Ti film deposition will be varied using different: (1) Design of substrate holder, (2) substrate material, and (3) coating thickness linking substrate with substrate holder. Obtained Ti films were characterized using were characterized with optical microscopy, SEM, and electrical resistivity measurement.

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