Browse By Repository:

 
 
 
   

Items where Author is "Lea, Hui Shan"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 1.

Lea, Hui Shan (2018) Development Of Acoustic Sensor Micro Bending Measurement System For Flexible Printed Circuit Board. Project Report. UTeM, Melaka, Malaysia. (Submitted)

This list was generated on Thu May 15 19:53:33 2025 MYT.
 
UNIVERSITI TEKNIKAL MALAYSIA MELAKA DIGITAL COLLECTION is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.