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Numerical Study Of Thermal Enhancement In Microchannel Heat Sink With Applying Cavities Technique

Zulkefly, Muhammad Zawawi (2019) Numerical Study Of Thermal Enhancement In Microchannel Heat Sink With Applying Cavities Technique. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The technology of computer begins to expand on 1940’s that make the transferring and processing data on computer become faster. As the technology begins to expand, the electrical component or device generate more heat. The heat that has been generated by electronic component will damaged the component or the performance of electronic device will be drop. Therefore, many researchers have study about the development of microchannel heat sink such as added cavities to heat transfer rate, less power consumptions, efficiency and etc. Although there are many shapes of cavities has been research with but there are still many shapes has not been discovering yet to improve the rate of heat transfer in the cavities. The purpose of this study is to generate a new model with applying cavities method and simulate the new models of microchannel heat sink with the cavities. Then, to analyse the heat transfer enhancement with numerical analysis method. After that, make a comparison of the rate of heat transfer between the rectangular microchannel heat sink model and the new microchannel heat sink with cavities models. There are three model that be generated by using SolidWorks software that is rectangular microchannel heat sink, microchannel heat sink with octagon cavities and microchannel heat sink with oval cavities. To analysis this model, a computational fluid dynamics (CFD) software that is ANSYS Fluent is being used. The analysis will consist of discussion in temperature and velocity. The results of this study show that the maximum temperature is gain in microchannel heat sink with oval cavities at 44.85o C. It shows that the percentage of performance is increase by 7.2%. The highest velocity also gains in microchannel heat sink with oval cavities at 3.336 m/s. The comparison is be made and decide that microchannel heat sink with oval cavities is the best design due to it gains the highest value in temperature and velocity. The findings suggest that to fabricate the model to run an experimental study to compare the results between simulation and experimental study. A good understanding of fluid mechanic is needed to evaluate the initial boundary condition to be same as the real situation.

Item Type: Final Year Project (Project Report)
Uncontrolled Keywords: Heat sinks (Electronics), Heat, Transmission
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Library > Final Year Project > FTKMP
Depositing User: Sabariah Ismail
Date Deposited: 07 Apr 2021 08:13
Last Modified: 07 Apr 2021 08:13
URI: http://digitalcollection.utem.edu.my/id/eprint/25124

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