Adhesion Characterization Of Electrically Conductive Polymer

Ko, Kar Choon (2019) Adhesion Characterization Of Electrically Conductive Polymer. Project Report. Universiti Teknikal Malaysia Melaka, Melaka, Malaysia. (Submitted)

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Abstract

Electrically conductive adhesive (ECA) had been widely used in various industry especially in the printed electronic industry. Generally, ECAs are mixtures of polymer binder and conductive filler and is an alternative way of replacing the conventional soldering method. ECAs offer more advantages such as lower curing temperature, lead-free, non-lethal, minimal increase in weight of assembly and compatibility with range of substrates. However, one of the challenges faced in conductive ink is the lack of adhesion to the adherend such that the nature of adherent surface influence the adhesive strength. Moreover, the effect of various thickness on the mechanical properties of conductive ink coated on a flexible material still have a lot of open question. This research describes about the adhesion characterization of electrically conductive polymer. The aim of this research is to investigate the mechanical properties of electrically conductive polymer on flexible materials by nanoindentation and to investigate the strength of joints bonded with two layers of different conductive polymers. The methodology used in this research includes the fabrication of specimens, tensile test joints under ASTM D1002 and nanoindentation testing to obtain the mechanical properties of thin film. The results showed that the joints treated with Methyl Ethyl Ketone (MEK) has higher failure load for both single and double layer of conductive polymer. Besides, specimen which was cured with MEK showed lower electrical resistivity due to functional group in MEK influence the electrical conductivity of ECA. As the thickness of the specimen increase, the electrical conductivity also increases. Based on the nanoindentation testing, it is found that the hardness of the film is independent with the thickness of the film. However, the elastic modulus of the film showed an obvious increment as the thickness of the coating increase. Moreover, the creep testing result also showed that the dwell time did not influence the hardness and elastic modulus of the film regarding the different of thickness and dwell time. For future work, it is recommended that the mechanical properties can be further evaluated by using other parameter setting such as constantly increasing the applied load and loading rate for the nanoindentation testing. Besides, it is recommended to use another type of conductive ink such as graphene ink to evaluate the mechanical properties as it is another type of conductive polymer which had been widely used in printed electronic industry.

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