Thermal And Flow Analysis Of Heat Sinks For CPU Cooling By ANSYS

Raman, Interan Thermal And Flow Analysis Of Heat Sinks For CPU Cooling By ANSYS. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The technology development nowadays towards the revolution of industry 4.0, where the development of digital computer in advance model and it’s needs are increasing day by day. When there are pros there will be cons as well, where the reliability of electronic components are getting affected extremely by the heat dissipation at which the junction operates. To work on higher processor units nowadays CPU needs a greater operating power, and as CPU design engineers there are forced to make the system smaller in the term of size because customer at this time wants everything to be in pocket size. As the size reduced the problem of transferring heat to the surrounding and controlling the temperature becomes vital. Currently the CFD simulations have become a problem solver where it’s does not cost anything in the term of price and it’s widely used in the studies of heat transfer. This report tells about the material that suit well to be heat sink. There are three type of material analyzed in this research, which is steel, aluminium and copper. The parameter such as heat dissipation, number of fins, fin thickness are taken from past experimental research, while the geometry of CPU chassis, CD, DVD, and HDD are taken from manufacturer data base. Besides that, in this research work the flow around the chassis has been analyzed to increase the cooling performance. The result of three different material type of heat sinks are compared in order to get the fine material that suit well to be heat sink fabrication material. Furthermore, the simulation of copper material heat sink shows a better characteristics in the simulation for heat transfer and having more inlet slots increase cooling capacity of heat sinks due to a large air flow inside the chassis.

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